5-Amino-1,3,4-thiadiazole-2-thiol as a new leveler for blind holes copper electroplating: Theoretical calculation and electrochemical studies-Reference-Cited by-同舟云学术

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5-Amino-1,3,4-thiadiazole-2-thiol as a new leveler for blind holes copper electroplating: Theoretical calculation and electrochemical studies

Published:2022-12 Issue: Volume:606 Page:154871
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Zhou Miaomiao,Meng Yachao,Ling Jingwei,Zhang Yu,Huang Wei,Min Yulin,Shen Xixun,Xu Qunjie

Funder

National Natural Science Foundation of China

Science and Technology Commission of Shanghai Municipality

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference49 articles.

1. Filling of microvia with an aspect ratio of 5 by copper electrodeposition;Lühn;Electrochim. Acta,2009

2. Formation mechanism of pinholes in electroplated Cu films and its mitigation;Chen;Thin Solid Films,2015

3. Electron backscatter diffraction characterization of blind hole fillings by electrolytic Cu deposition;Ho;Thin Solid Films,2014

4. Influence of convection-dependent adsorption of additives on microvia filling by copper electroplating;Dow;J. Electrochem. Soc.,2005

5. Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives;Pasquale;Electrochim. Acta,2008

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2. Investigation on synthesis and mechanism of a Sudan Ⅰ copper electrodeposition leveler based on influencing ion diffusion strategy;Dyes and Pigments;2024-08

3. Numerical and experimental investigation of 2-thiazoline-2-thiol and nitrotetrazolium blue chloride compound as levelers for through-hole copper electroplating;Materials Today Communications;2024-08

4. Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers;Nano Materials Science;2024-07

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