Formation mechanism of pinholes in electroplated Cu films and its mitigation-Reference-Cited by-同舟云学术

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Formation mechanism of pinholes in electroplated Cu films and its mitigation

Published:2015-12 Issue: Volume:596 Page:209-215
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Chen Chang-Chih,Hsieh Cheng-Hui,Lee Yu-Wei,Yang Cheng-Hsien,Ho Cheng-En

Funder

Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference32 articles.

1. Damascene copper electroplating for chip interconnections;Andricacos;IBM J. Res. Dev.,1998

2. Via-filling using electroplating for build-up PCBs;Kobayashi;Electrochim. Acta,2001

3. Electron backscatter diffraction characterization of microstructure evolution of electroplated copper film;Kim;Mater. Trans.,2010

4. Superfilling and the curvature enhanced accelerator coverage mechanism;Moffat;Electrochem. Soc. Interface,2004

5. Through-hole filling by copper electroplating;Dow;J. Electrochem. Soc.,2008

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