Analysis of stress in sputter-deposited films using a kinetic model for Cu, Ni, Co, Cr, Mo, W-Reference-Cited by-同舟云学术

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Analysis of stress in sputter-deposited films using a kinetic model for Cu, Ni, Co, Cr, Mo, W

Published:2023-03 Issue: Volume:613 Page:156000
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Su Tong,Rao Zhaoxia,Berman Sarah,Depla Diederik,Chason Eric

Funder

National Science Foundation

European Commission

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference50 articles.

1. Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models;Chason;J. Appl. Phys.,2016

2. Understanding residual stress in thin films: analyzing wafer curvature measurements for Ag, Cu, Ni, Fe, Ti, and Cr with a kinetic model;Rao;J. Appl. Phys.,2021

3. L.B. Freund, S. Suresh, Thin Film Materials: Stress, Defect Formation, and Surface Evolution, Cambridge University Press, Cambridge, England; New York, 2003.

4. The intrinsic stress of polycrystalline and epitaxial thin metal-films;Koch;J. Condens. Matter Phys.,1994

5. The state of residual-stress in tin films made by physical vapor-deposition methods - the state-of-the-art;Perry;J. Vac. Sci. Technol.,1990

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Stress evolution in sputtered vanadium-tungsten alloys;Surface and Coatings Technology;2023-12

2. Computational tool for analyzing stress in thin films;Surface and Coatings Technology;2023-12

3. Plasmas and acoustic waves to pattern the nanostructure and chemistry of thin films;Acta Materialia;2023-08

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