UV excimer laser drilled high aspect ratio submicron via hole-Reference-Cited by-同舟云学术

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UV excimer laser drilled high aspect ratio submicron via hole

Published:2009-10 Issue:1 Volume:256 Page:183-186
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Chen K.H.,Wu Wenhsing,Chu Byung Hwan,Chang C.Y.,Lin Jenshan,Pearton S.J.,Norton D.P.,Ren F.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference10 articles.

1. High-quality and high-efficiency machining of glass materials by laser-induced plasma-assisted ablation using conventional nanosecond UV, visible, and infrared lasers

2. Optodynamic monitoring of the laser drilling of through-holes in glass ampoules

3. Femtosecond laser-drilled capillary integrated into a microfluidic device

4. SiC via holes by laser drilling

5. Laser micromachining of SrTiO3 single crystal

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A review on laser drilling and cutting of silicon;Journal of the European Ceramic Society;2021-08

2. Laser-drilled micro-hole arrays on polyurethane synthetic leather for improvement of water vapor permeability;Applied Surface Science;2014-06

3. A Parameters Optimization of the CO₂ Laser Drilling Process for HDI Microvia Fabrication;Applied Mechanics and Materials;2012-11

4. Circular and Rectangular Via Holes Formed in SiC via Using ArF Based UV Excimer Laser;ECS Transactions;2011-10-04

5. Circular and rectangular via holes formed in SiC via using ArF based UV excimer laser;Applied Surface Science;2011-01

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