Grinding of silicon wafers using an ultrafine diamond wheel of a hybrid bond material
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference29 articles.
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3. Characteristics of silicon substrates fabricated using nanogrinding and chemo-mechanical-grinding;Huang;Materials Science and Engineering A,2008
4. Simultaneous double side grinding of silicon wafers: a literature review;Li;International Journal of Machine Tool and Manufacture,2006
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