Effect of ultraprecision grinding on the microstructural change in silicon monocrystals
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
Reference18 articles.
1. Subsurface damage in single-crystal silicon due to grinding and polishing
2. High resolution studies of crystalline damage induced by lapping and single-point diamond machining of Si(100)
3. Ductile-regime turning mechanism of single-crystal silicon
4. Ductile-Regime Machining of Germanium and Silicon
5. Subsurface Damage in Single Diamond Tool Machined SI Wafers
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