Size distribution monitoring for chemical mechanical polishing slurries: An intercomparison of electron microscopy, dynamic light scattering, and differential mobility analysis-Reference-Cited by-同舟云学术

Size distribution monitoring for chemical mechanical polishing slurries: An intercomparison of electron microscopy, dynamic light scattering, and differential mobility analysis

Published:2022-01 Issue: Volume:396 Page:395-405
ISSN:0032-5910
Container-title:Powder Technology
language:en
Short-container-title:Powder Technology

Author:

Lee Jihyeon,He Siqin,Song Guanyu,Hogan Christopher J.

Publisher

Elsevier BV

Subject

General Chemical Engineering

Reference62 articles.

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2. Effect of abrasive particle size distribution on removal rate of silicon wafers;Wang;ECS J. Solid State Sci. Technol.,2020

3. The importance of particle size to the performance of abrasive particles in the CMP process;Pohl;J. Electron. Mater.,1996

4. Nominal particle size of multi-sized particulate slurries for evaluation of erosion wear and effect of fine particles;Gandhi;Wear,2004

5. Effects of slurry particles on silicon dioxide CMP;Choi;J. Electrochem. Soc.,2004

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