The Importance of Particle Size to the Performance of Abrasive Particles in the CMP Process-Reference-Cited by-同舟云学术

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The Importance of Particle Size to the Performance of Abrasive Particles in the CMP Process

Published:1996-10 Issue:10 Volume:25 Page:1612-1616
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Pohl Michael C.,Griffiths Duncan A.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02655584.pdf

Reference15 articles.

1. Michael A. Martinez,Solid State Tech. September, 44 (1995).

2. Beyer et al., U.S. Patent 4,944,836, July 31, 1990.

3. Geraldine C. Schwartz, presented at SemiCon West on July 14, 1995.

4. Jim Schlueter, presented at SemiCon Southwest 95 on October 18, 1995.

5. Norton Diamond Compounds and Slurries, technical brochure from Norton Company, Abrasives Marketing Group, Worcester, MA 01606-2698.

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