Acceleration factors for plastic encapsulated semiconductor devices and their relationship to field performance-Reference-Cited by-同舟云学术

Acceleration factors for plastic encapsulated semiconductor devices and their relationship to field performance

Published:1975-02 Issue:1 Volume:14 Page:63-66
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Reich Bernard

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Reliability in plastic encapsulated semiconductors;Herr,1970

2. Rome Air Development Center;Berington;Technical Report RADC-TR-71-8,1971

3. Solid State Technol.;Reich,1972

4. Proceedings of the 10th Annual Reliability Physics Symposium;Reich,1972

5. Proceedings of the 10th Annual Reliability Physics Symposium;Halleck,1972

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1. Package Sealing and Encapsulation;Microelectronics Packaging Handbook;1997

2. A model for mechanisms in plastic-encapsulated microelectronic devices during temperature-humidity tests—II;Microelectronics Reliability;1991-01

3. A model for mechanisms in plastic encapsulated microelectronic devices during temperature-humidity tests—I;Microelectronics Reliability;1990-01

4. Package Sealing and Encapsulation;Microelectronics Packaging Handbook;1989

5. A Study of Accelerated Storage Test Conditions Applicable to Semiconductor Devices and Microcircuits;IEEE Transactions on Reliability;1978-08