Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference6 articles.
1. A model for mechanisms in plastic encapsulated microelectronic devices during temperature-humidity tests—I;Matthäi;Microelectron. Reliab.,1990
2. Temperature-humidity acceleration of metal analysis failure in semiconductor devices;Peck,1973
3. Acceleration factors for plastic encapsulated semiconductor devices and their relationship to field performance;Reich;Microelectron. Reliab.,1975
4. US Army field test of plastic encapsulated devices;Hakim;Microelectron. Reliab.,1978
5. Zuverlässigkeit von Halbleiterbauelementen;Bickley;Elekronik München,1981
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献