Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference4 articles.
1. Field reliability of plastic encapsulated transistors and integrated circuits;Reich;Microelectron. Reliab.,1971
2. Environmental factors governing field reliability of plastic transistors and integrated circuits;Reich,1972
3. The use of reliable plastic semiconductors in military equipment;Reich;Microelectron. Reliab.,1976
4. Failure mechanisms in gold metallized sealed junction devices;Hakim;Solid St. Technol.,1975
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