1. C.R. Gray. “Integrated Circuits Reliability”,10th Ann. Proc, Rel. Phys. Symp, pp. 100–101, April 1972.
2. R.E. Sundius. “A Recommendation for Ceramic Over Plastic IC Packages for 1972 Real-Time Consumer Computer System”, 10th Ann. Proc, Rel. Phys. Symp., pp. 102–104, April 1972.
3. R.W. Thomas. “Moisture, Myths and Microcircuits”, IEEE Trans, on Parts, Hybrids and Packaging, PHP-12(3): pp. 167–171, September 1976.
4. J.L. Jellison. “Susceptibility of Micro Welds in Hybrids to Corrosion Degradation”, 13th Ann. Proc, Rel. Phys. Symp., pp. 70–79, April 1975.
5. H. Koelmans. “Metallization Corrosion in Silicon Devices by Moisture-Induced Electrolysis”, 12th Annual Rel. Phys. Symposium, pp. 168–171, 1974.