Author:
Wong C. P.,Clegg D. B.,Kumar Ananda H.,Otsuka K.,Ozmat Berhan
Reference76 articles.
1. C. P. Wong (ed.). Polymers for Electronic and Photonic Applications, Academic Press, San Diego, CA, 1993, and references therein.
2. C. P. Wong. “Overview of IC Device Encapsulants as Device Packaging,” J. Electron. Packaging, 3: p. 97, 1989
3. R. W. Thomas. “Moisture, Myths and Microcircuits,” IEEE Trans. Parts, Hybrids Packaging, PHP-12 (3): pp. 167–171, 1976
4. J. L. Jellison. “Susceptibility of Micro Welds in Hybrids to Corrosion.’ Degradation,’ “13th Annual Proceedings, Reliability Physics Symposium, pp. 70–79, 1975
5. H. Koelmans. “Metallization Corrosion in Silicon Devices by Moisture-Induced Electrolysis,” 12th Annual Reliability Physics Symposium, pp. 168–171, 1974
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