Investigations of wetting properties of Ni–V and Ni–Co alloys by Sn, Sn–Pb, Sn–Cu, and Sn–Ag

Investigations of wetting properties of Ni–V and Ni–Co alloys by Sn, Sn–Pb, Sn–Cu, and Sn–Ag–Cu solders

Published:2011-03 Issue:2 Volume:42 Page:350-355
ISSN:1876-1070
Container-title:Journal of the Taiwan Institute of Chemical Engineers
language:en
Short-container-title:Journal of the Taiwan Institute of Chemical Engineers

Author:

Fu Chun-Chong,Chen Chih-chi

Publisher

Elsevier BV

Subject

General Chemical Engineering,General Chemistry

Reference61 articles.

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3. Evaluation of Lead-Free Solder Joints in Electronic Assemblies;Artaki;J. Electron. Mater.,1994

4. Wettability;Berg,1993

5. Chang, H.-Y., “Reactive Wetting between Lead-free Solders and Substrates,” M.S. Thesis, Department of Chemical Engineering, National Tsing Hua University, Taiwan (2002).

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