Reinforcement size effect on thermal conductivity in Cu-B/diamond composite
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference34 articles.
1. Energy dissipation and transport in nanoscale devices
2. Thermal properties of diamond/copper composite material
3. High thermal conductivity of Cu-B/diamond composites prepared by gas pressure infiltration
4. Combining Cr pre-coating and Cr alloying to improve the thermal conductivity of diamond particles reinforced Cu matrix composites
5. High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites
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2. First-principles comparative study on diamond/carbide combinations: Interfacial adhesion and bonding nature;International Journal of Refractory Metals and Hard Materials;2024-02
3. Interfacial structures and their effect on thermal conductivity and mechanical properties of diamond/Cu−B composites;Transactions of Nonferrous Metals Society of China;2024-01
4. Investigation of the matrix and interface of Cu–B/diamond composite by atom probe tomography;Ceramics International;2024-01
5. Adhesive and tensile properties of diamond(001)/TiC(111) interfaces: A first-principles investigation;International Journal of Refractory Metals and Hard Materials;2023-12
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