Author:
Haque Shatil,Siddabattula Kalyan,Craven Mike,Wen Sihua,Liu Xingsheng,Boroyevich Dusan,Lu Guo-Quan
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. Jacob P, et al. Reliability testing and analysis of IGBT power semiconductor modules. Proceedings of the International Symposium for Testing and Failure Analysis, 1994. p. 319–25
2. Schuetze T, Berg H, Hierholzer M. Further improvements in the reliability of IGBT modules. eupec Warstein, Proceedings of PCIM99, Nuremberg, Germany, 1999
3. Bogdanski J, Leal J, Yang H. Practical design issues to bump and flip. Flip Chip Technology, Phoenix, AZ, 1998
4. Tummala RR, Rymaszeski EJ. Microelectronic packaging handbook. New York: VanNostrand Reinhold; 1989. p. 366–91
5. Haque S, et al. An innovative technique for packaging power electronics building blocks using metal posts interconnected parallel plate structures. IEEE-CPMT Trans Part B 1999:136–44
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献