Ceramic Packaging
Author:
Publisher
Springer US
Link
http://link.springer.com/content/pdf/10.1007/978-1-4613-1069-3_7.pdf
Reference58 articles.
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3. R.G. Frieser. “A Review of Solder Glasses”,Electrocomponent Science and Technology. 2: pp. 163–199, June 1975.
4. R.H.F. Lloyd. “ASLT: An Extension of Hybrid-Miniaturization Techniques”,IBM J. Res. Develop., 11(4): pp. 86–92, April 1967.
5. P.E. Fox and W.J. Nestork. “Design of Logic-Circuit Technology for IBM System 370 Models 145and 155”,IBM J. Res. Develop., 15(2): pp. 384–390, February 1971.
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