Author:
Sung Jae Suk,Koo Ki Duk,Park Jeong Hyun
Subject
Materials Chemistry,Ceramics and Composites
Reference30 articles.
1. Ceramic Packaging
2. Ceramics in Microelectronic Packaging;Tummala;Am. Ceram. Soc. Bull.,1988
3. D. L. Wilcox Ceramics for Packaging, Parts 1 and 2 Solid State Technol. Jan. 55 60 1971
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