Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection-Reference-Cited by-同舟云学术

Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection

Published:2016-08 Issue: Volume:63 Page:104-110
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Berry David^ORCID,Townsend Adrian^ORCID,He Weikun,Zheng Hanguang,Ngo Khai D.T.,Lu Guo-Quan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference30 articles.

1. Electronic Packaging and Interconnection Handbook;Harper,2000

2. Microelectronics Packaging Handbook;Tummala,1997

3. Materials Selection in Mechanical Design;Ashby,1996

4. Ageing and failure modes of IGBT modules in high-temperature power cycling;Smet;IEE Trans. Ind. Electron.,2011

5. Planar power module with low thermal impedance and low thermomechanical stress;Xiao;IEEE Trans. Compon. Packag. Manuf. Technol.,2012

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improving thermal stability and reliability of power chips by sintering foam structure layer;Applied Materials Today;2024-10

2. Review of Double-Sided Cooling Power Modules for Driving Electric Vehicles;IEEE Transactions on Device and Materials Reliability;2023-06

3. Reliability Improvement of a Double-Sided IGBT Module by Lowering Stress Gradient Using Molybdenum Buffers;IEEE Journal of Emerging and Selected Topics in Power Electronics;2019-09

4. Low-temperature Silver Sintering for Bonding 3D Power Modules;2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D);2019-05

5. Fabrication of large-area interconnects by sintering of micron Ag paste;Materials Letters;2018-09