Low-temperature Silver Sintering for Bonding 3D Power Modules
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8732272/8735102/08735123.pdf?arnumber=8735123
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Microstructural evolution, fracture behavior and bonding mechanisms study of copper sintering on bare DBC substrate for SiC power electronics packaging;Journal of Materials Research and Technology;2022-07
2. Coalescence kinetics and microstructure evolution of Cu nanoparticles sintering on substrates: a molecular dynamics study;Journal of Materials Research and Technology;2022-03
3. Interleaved Planar Packaging Method of Multichip SiC Power Module for Thermal and Electrical Performance Improvement;IEEE Transactions on Power Electronics;2022-02
4. Thermal and Thermomechanical Analysis of a 10 kV SiC MOSFET Package with Double-Sided Cooling;2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA);2021-11-07
5. Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding;Electronic Materials Letters;2020-05-21
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