Thermal stability of cobalt and nickel silicides-Reference-Cited by-同舟云学术

Thermal stability of cobalt and nickel silicides

Published:1998-09 Issue:9 Volume:38 Page:1495-1498
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Poon M.C,Ho C.H,Deng F,Lau S.S,Wong H

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Philips JR, Revesz P, Olowolafe JO, Mayer JW. Thermal stability of CoSi2 on single crystal and polycrystalline silicon. In: Materials Research Society Proceedings, vol. 182. 1990:57–63

2. Formation and stability of silicides on polycrystalline silicon;Colgan;Mater Sci Engng Rev Reports,1996

3. Nickel silicide thermal stability on polycrystalline and single crystalline silicon;Colgan;Mater Chem Phys,1996

4. Degradation mechanisms and improvement of thermal stability of CoSi2 /polycrystalline Si layers;Chen;Appl Phys Lett,1994

Cited by 33 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhancement of NiO_x/Poly‐Si Contact Performance by Insertion of an Ultrathin Metallic Ni Interlayer;physica status solidi (a);2023-05-31

2. Processing and characterization of co silicide ohmic contacts to 4H–SiC;Journal of Materials Science: Materials in Electronics;2020-08-14

3. Self-Controlled Synthesis of Microscale Silicide Embossments and Pits with Multi-Shape and Orientation;Nanoscience and Nanotechnology Letters;2015-11-01

4. The effects of grain boundary scattering on electrical resistivity of Ag/NiSi silicide films formed on silicon substrate at 500 °C by RTA;Applied Surface Science;2014-08

5. Progresses in cMUT device fabrication using low temperature processes;Journal of Micromechanics and Microengineering;2014-03-25