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Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate

  • Published:2019-08 Issue:8 Volume:29 Page:1696-1704
  • ISSN:1003-6326
  • Container-title:Transactions of Nonferrous Metals Society of China
  • language:en
  • Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

TUNTHAWIROON Phacharaphon,KANLAYASIRI Kannachai

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference41 articles.

1. Properties and microstructures of Sn–Bi–X lead-free solders [J];YANG;Advances in Materials Science and Engineering,2016

2. Electrochemical corrosion behaviour of lead-free Sn–8.5Zn–XAg–0.1Al–0.5Ga solder in 3.5% NaCl solution [J];MOHANTY;Materials Science and Engineering A,2005

3. The role of Zn precipitates and Cl– anions in pitting corrosion of Sn–Zn solder alloys [J];LIU;Corrosion Science,2015

4. Interfacial reaction of Sn–Ag–Cu lead-free solder alloy on Cu: A review [J];LEE;Advances in Materials Science and Engineering,2013

5. A study of nanoparticles in Sn–Ag based lead free solders [J];AMAGAI;Microelectronics Reliability,2008

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