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Brazing diamond/Cu composite to alumina using reactive Ag-Cu-Ti alloy

  • Published:2013-06 Issue:6 Volume:23 Page:1701-1708
  • ISSN:1003-6326
  • Container-title:Transactions of Nonferrous Metals Society of China
  • language:en
  • Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

WU Mao,CAO Che-zheng,Rafi-ud-din ,HE Xin-bo,QU Xuan-hui

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference17 articles.

1. Thermal materials solve power electronics challenges [J];ZWEBEN;Power Electronics Technology,2006

2. Thermal properties of diamond/copper composite material [J];YOSHIDA;Microelectronics Reliability,2004

3. Modeling of the thermal conductivity and thermomechanical behavior of diamond reinforced composites [J];SERGIO;International Journal of Engineering Science,2008

4. Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials [J];XIA;Transactions of Nonferrous Metals Society of China,2009

5. Effect of coating on the microstructure and thermal conductivities of diamond-Cu composites prepared by powder metallurgy [J];REN;Composites Science and Technology,2011

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