Effect of initial microstructure, frequency and temperature on the low cycle fatigue behaviour of the soldering alloys 96.5Sn–3.5Ag and 63Sn–37Pb
Author:
Publisher
Elsevier BV
Subject
General Engineering,General Materials Science
Reference15 articles.
1. Behavior of materials under conditions of thermal stress, heat transfer symposium;Manson,1953
2. Effect of temperature on isothermal low cycle fatigue properties of Sn–Ag eutectic solder
3. Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder
4. Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders
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2. Microstructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder joints;Engineering Failure Analysis;2020-11
3. Evaluation of creep properties for aged Pb-free solder joints/(Ni-P/Au) UBM with small addition Cu using shear punch creep testing method;Engineering Failure Analysis;2020-07
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5. Electronic Packaging: Solder Mounting Technologies;Reference Module in Materials Science and Materials Engineering;2016
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