Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder-Reference-Cited by-同舟云学术

Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder

Published:2002-12 Issue:3 Volume:14 Page:30-36
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Kanchanomai C.,Miyashita Y.,Mutoh Y.,Mannan S.L.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference16 articles.

1. Lead-free Solders in Microelectronics

2. ASTM E606 (1998), “Standard practice for strain‐controlled fatigue testing”, The American Society for Testing and Materials, Vol. 03.01, pp. 525–39.

3. Coffin, L.F. Jr (1954), “A study of the effects of cyclic thermal stresses on a ductile metal”, Transactions of ASME, Vol. 76, pp. 931–50.

4. Isothermal Fatigue of 63Sn-37Pb Solder

5. Low-cycle fatigue behavior and mechanisms of a lead-free solder 96.5Sn/3.5Ag

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