Author:
Thambi J.,Tetzlaff U.,Schiessl A.,Lang K.-D.,Waltz M.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Solder Joint Reliability: Theory and Applications;Lau,1991
2. Solder Joint Technology - Material, Properties and Reliabiltiy;King,2007
3. Effect of initial microstructure, frequency and temperature on the low cycle fatigue behaviour of the soldering alloys 96.5Sn–3.5Ag and 63Sn–37Pb;Solomon;Eng. Fail. Anal.,2008
4. Mechanical fatigue of Sn rich Pb free solder alloys;Shang,2006
5. Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density;Lee;Int. J. Fatigue,2014
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