Effect of temperature on isothermal low cycle fatigue properties of Sn–Ag eutectic solder
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference27 articles.
1. Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys
2. Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder
3. A STUDY OF FATIGUE AND CREEP BEHAVIOUR OF FOUR HIGH TEMPERATURE SOLDERS
4. Low-cycle fatigue behavior and mechanisms of a lead-free solder 96.5Sn/3.5Ag
5. Low cycle fatigue test for solders using non-contact digital image measurement system
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1. Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature;Journal of Materials Engineering and Performance;2023-07-31
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4. Unveiling the damage evolution of SAC305 during fatigue by entropy generation;International Journal of Mechanical Sciences;2023-04
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