Author:
Molina-Aldareguia J.M.,Ocaña I.,González D.,Elizalde M.R.,Sánchez J.M.,Martínez-Esnaola J.M.,Gil-Sevillano J.,Scherban T.,Pantuso D.,Sun B.,Xu G.,Miner B.,He J.,Maiz J.
Subject
General Engineering,General Materials Science
Reference26 articles.
1. Mechanical properties of thin films;Nix;Met Mater Trans A,1989
2. Silicon integrated circuit technology from past to future;Iwai;Microelectron Reliab,2002
3. Integration of fluorine-doped silicon oxide in copper pilot line for 0.12μm technology;Reynard;Microelectron Eng,2002
4. The thermo-mechanical integrity of thin films and multilayers;Evans;Acta Metall Mater,1995
5. Liu XH, Suo Z, Ma Q, Fujimoto H. Cracking and debonding in integrated microstructures. In: Bravman JC, Marieb TN, Lloyd TR, Korhonen MA, editors. MRS Proceedings 516. Materials reliability in microelectronics VIII, 1998. p. 313–24.
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