Characterisation of Interfacial Adhesion of Thin Film/Substrate Systems Using Indentation-Induced Delamination: A Focused Review-Reference-Cited by-同舟云学术

Characterisation of Interfacial Adhesion of Thin Film/Substrate Systems Using Indentation-Induced Delamination: A Focused Review

Published:2012-12 Issue: Volume:533 Page:201-222
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Lu Ming Yuan¹,Xie Hong Tao¹,Huang Han¹

Affiliation:

1. University of Queensland

Abstract

This review summarized the research works on the characterisation of interfacial adhesion in thin film/substrate bilayer structure by use of indentation testing. It focused on the delamination mechanics between a thin film and a substrate induced by indentation and the quantitative characterisation of interfacial strength in such bilayer systems. Three major techniques were introduced, namely conventional indentation, cross-sectional indentation and acoustic emission assisted indentation. A number of theoretical models and finite element simulation studies were discussed, in association with the experimental investigations. Key words:Thin film, bilayer, delamination, adhesion, indentation, acoustic emission

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.533.201.pdf

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