Phenomenological Analysis of Indentation Diagrams for Topocomposites on a Compliant Substrate
Author:
Publisher
Allerton Press
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Safety, Risk, Reliability and Quality
Link
https://link.springer.com/content/pdf/10.3103/S1052618822010113.pdf
Reference12 articles.
1. Golovin, Yu.I., Nanoindentirovanie i ego vozmozhnosti (Nanoindentation and Its Capabilities), Moscow: Mashinostroenie, 2009.
2. Bhushan, B., Depth-sensing nanoindentation measurement techniques and applications, Microsyst. Technol., 2017, vol. 23, pp. 1595–1649. https://doi.org/10.1007/s00542-017-3372-2
3. Chen, J., Lin, Z., Bull, S.J., Phillips, C.L., and Bristowe, P.D., Experimental and modelling techniques for assessing the adhesion of very thin coatings on glass, J. Phys. D: Appl. Phys., 2009, vol. 42, p. 214003. https://doi.org/10.1088/0022-3727/42/21/214003
4. Abdul-Baqi, A. and Van der Giessen, E., Delamination of a strong film from a ductile substrate during indentation unloading, J. Mater. Res., 2001, vol. 16, no. 5, pp. 1396–1407. https://doi.org/10.1557/JMR.2001.0195
5. Lu, M., Xie, H., and Huang, H., Characterization of interfacial adhesion of thin film/substrate systems using indentation-induced delamination: a focused review, Key Eng. Mater., 2013, vol. 533, pp. 201–222. https://doi.org/10.4028/www.scientific.net/KEM.533.201
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