1. Low dielectric constant materials for microelectronics
2. Low Dielectric Constant Materials for ULSI Interconnects
3. D. Ingerly, S. Agraharam, D. Becher, V. Chikarmane, K. Fischer, R. Grover, M. Goodner, S. Haight, J. He, T. Ibrahim, S. Joshi, H. Kothari, K. Lee, Y. Lin, C. Litteken, H. Liu, E. Mays, P. Moon, T. Mule, S. Nolen, N. Patel, S. Pradhan, J. Robinson, P. Ramanarayanan, S. Sattiraju, T. Schroeder, S. Williams, and P. Yashar, paper presented at the International Interconnect Technology Conference (IITC), 2008.
4. D. Ingerly, A. Agrawal, R. Ascazubi, A. Blattner, M. Buehler, V. Chikarmane, B. Choudhury, F. Cinnor, C. Ege, C. Ganpule, T. Glassman, R. Grover, P. Hentges, J. Hicks, D. Jones, A. Kandas, H. Khan, N. Lazo, K. S. Lee, H. Liu, A. Madhavan, R. McFadden, T. Mule, D. Parsons, P. Parthangal, S. Rangaraj, D. Rao, J. Roesler, A. Schmitz, M. Sharma, J. Shin, Y. Shusterman, N. Speer, P. Tiwari, G. Wang, P. Yashar, and K. Mistry, paper presented at the IEEE International Interconnect Technology Conference (IITC), 2012.
5. Chip-packaging interaction: a critical concern for Cu/low k packaging