Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference25 articles.
1. Research update: lead-free solder alternatives;Bath;Circ Assemb,2000
2. Solder joint reliability and characteristics of deformation and crack growth of Sn–Ag–Cu versus eutectic Sn–Pb on a WLP in a thermal cycling test;Kim;IEEE Trans Electron Pack Manu,2002
3. Tin–silver–copper eutectic temperature and composition;Loomans;Metall Mater Trans A,2000
4. Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders;Schubert,2001
5. Properties of lead-free solder SnAgCu containing minute amounts of rare earth;Chen;J Electron Mater,2003
Cited by
33 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献