Solder joint reliability and characteristics of deformation and crack growth of Sn-Ag-Cu versus eutectic Sn-Pb on a WLP in a thermal cycling test-Reference-Cited by-同舟云学术

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Solder joint reliability and characteristics of deformation and crack growth of Sn-Ag-Cu versus eutectic Sn-Pb on a WLP in a thermal cycling test

Published:2002-04 Issue:2 Volume:25 Page:84-90
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:en
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Deok-Hoon Kim ,Elenius P.,Barrett S.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/21979/01021592.pdf?arnumber=1021592

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability of Electronic Packaging;Springer Handbook of Engineering Statistics;2023

2. Effects of Aging on Microstructure and Mechanical Properties of Sn-Ag-Cu-Bi Solder Alloys;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

3. Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn–3.0Ag–0.5Cu solder joints during current-stressing;Journal of Alloys and Compounds;2021-01

4. Stress and reliability analysis for interconnects;Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore;2020

5. Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB;Journal of Alloys and Compounds;2019-02

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