Strain dependence of deformation and recrystallization microstructure homogeneity in clock-rolled tantalum sheets-Reference-Cited by-同舟云学术

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Strain dependence of deformation and recrystallization microstructure homogeneity in clock-rolled tantalum sheets

Published:2020-03 Issue: Volume:161 Page:110165
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Zhu Jialin,Liu Shifeng,Yang Shuai,Long Doudou,Liu Yahui,Yuan Xiaoli,Orlov Dmytro

Funder

National Natural Science Foundation of China

Chongqing Research Program of Basic Research and Frontier Technology

Chongqing Municipal Education Commission

Major “Scientific and Technological Innovation 2025” Project of Ningbo

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference47 articles.

1. Failure mechanism models for electromigration;Young;IEEE Trans. Reliab.,1994

2. Tantalum and niobium as a diffusion barrier between copper and silicon;Jang;J. Electron. Mater.,1996

3. Behavior of ionized metal plasmadeposited Ta diffusion barrier between Cu and SiO2;Latt;J. Mater. Sci.,2002

4. Tantalum as a diffusion barrier between copper and silicon;Holloway;Appl. Phys. Lett.,1990

5. Correlating discrete orientation and grain size to the sputter deposition properties of tantalum;Michaluk;J. Electron. Mater.,2002

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