Melting and solidification properties of the nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference28 articles.
1. Interfacial reactions between lead-free solders and common base materials;Laurila;Mater Sci Eng R,2005
2. Advances in lead-free electronics soldering;Suganuma;Curr Opin Solid ST M,2001
3. Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy;Dong;J Mater Sci Mater Electron,2009
4. Effect of particle size distributions on the rheology of Sn/Ag/Cu lead-free solder pastes;Zhang;Mater Des,2010
5. Mechanical characterization of Sn–Ag-based lead-free solders;Amagai;Microelectron Reliab,2002
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