Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components-Reference-Cited by-同舟云学术

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Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components

Published:2022-11 Issue: Volume:21 Page:308-318
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Straubinger Dániel^ORCID,Hurtony Tamás^ORCID,Géczy Attila

Funder

Nemzeti Kutatási Fejlesztési és Innovációs Hivatal

Nemzeti Kutatási, Fejlesztési és Innovaciós Alap

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference45 articles.

1. Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere;Tao;Solder Surf Mt Technol,2017

2. Electromigration in 3D-IC scale Cu/Sn/Cu solder joints;Ho;J Alloys Compd,2016

3. Electromigration of Sn–3Ag–0.5Cu and Sn–3Ag–0.5Cu–0.5Ce–0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads;Lin;J Alloys Compd,2009

4. Electromigration mechanism of failure in flip-chip solder joints based on discrete void formation;Chang;Sci Rep,2017

5. Current-crowding-induced electromigration failure in flip chip solder joints ARTICLES YOU MAY BE INTERESTED IN;Yeh;Appl Phys Lett,2002

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of CuO nanoparticles on SAC composite solder joints: Microstructural and DFT study;Journal of Materials Research and Technology;2024-09

2. Correlations of microstructure and mechanical and thermal parameters of solder joints by X-ray CT and simulations;International Communications in Heat and Mass Transfer;2024-09

3. Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints;Journal of Electronic Packaging;2024-08-09

4. Effect of non-standard SnAg surface finishes on properties of solder joints;Applied Surface Science Advances;2023-12

5. Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing;Journal of Materials Research and Technology;2023-07

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