Electromigration of Sn–3Ag–0.5Cu and Sn–3Ag–0.5Cu–0.5Ce–0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference20 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Effects of rare earth Ce on microstructures, solderability of Sn–Ag–Cu and Sn–Cu–Ni solders as well as mechanical properties of soldered joints
3. Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements
4. Investigation on properties of Sn–8Zn–3Bi lead-free solder by Nd addition
5. Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint
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1. Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components;Journal of Materials Research and Technology;2022-11
2. Impact of Electromigration and Isothermal Ageing on Lead-Free Solder Joints of Chip-Sized Smd Components;SSRN Electronic Journal;2022
3. Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints;Journal of Materials Science: Materials in Electronics;2020-07-24
4. New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints;Materials & Design;2020-07
5. The reliability of lead-free solder joint subjected to special environment: a review;Journal of Materials Science: Materials in Electronics;2019-04-19
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