Impact of Electromigration and Isothermal Ageing on Lead-Free Solder Joints of Chip-Sized Smd Components

Author:

Straubinger Dániel,Hurtony Tamás,Géczy Attila

Publisher

Elsevier BV

Subject

General Earth and Planetary Sciences,General Environmental Science

Reference45 articles.

1. Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere;Y Tao;Soldering & Surface Mount Technology,2017

2. Electromigration in 3D-IC scale Cu/Sn/Cu solder joints;C E Ho;Journal of Alloys and Compounds,2016

3. Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads;H J Lin;Journal of Alloys and Compounds,2009

4. Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation;Y.-W Chang;Scientific Reports,2017

5. Current-crowding-induced electromigration failure in flip chip solder joints ARTICLES YOU MAY BE INTERESTED IN;E C C Yeh;Appl. Phys. Lett,2002

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