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Influence of graphene content and nickel decoration on the microstructural and mechanical characteristics of the Cu/Sn–Ag–Cu/Cu soldered joint

  • Published:2020-07 Issue:4 Volume:9 Page:8953-8970
  • ISSN:2238-7854
  • Container-title:Journal of Materials Research and Technology
  • language:en
  • Short-container-title:Journal of Materials Research and Technology

Author:

Sayyadi R.,Khodabakhshi F.,Javid N. Shahamat,Khatibi G.

Funder

National Foundation for Science and Technology Development

Bundesministerium für Digitalisierung und Wirtschaftsstandort

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference65 articles.

1. Principles of soldering and brazing;Humpston,1993

2. Structure and properties of lead-free solders bearing micro and nano particles;Zhang;Mater Sci Eng R,2014

3. Aging induced structural and electrochemical corrosion behaviour of Sn-1.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu solder alloys;Kaushik;J Alloys Compd,2018

4. Mechanisms of beta-Sn nucleation and microstructure evolution in Sn–Ag–Cu solders containing titanium;Ma;J Alloys Compd,2019

5. Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint;Bang;J Alloys Compd,2017

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