Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint-Reference-Cited by-同舟云学术

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Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

Published:2017-12 Issue: Volume:728 Page:992-1001
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Bang Junghwan^ORCID,Yu Dong-Yurl,Ko Yong-Ho,Kim Min-Su,Nishikawa Hiroshi,Lee Chang-Woo

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference28 articles.

1. Pb-free solders for electronic packaging;Kang;J. Electron. Mater.,1994

2. A study of SnAgNi Co vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint;Leng,2008

3. The changing automotive environment: high-temperature electronics;Johnson;IEEE Trans. Electron. Pack. Manuf.,2004

4. Creep behavior of mixed SAC 405/SnPb soldered assemblies in shear loading;Limaye,2007

5. Effects of alloying elements on the characteristics of Sn-Zn lead-free solder;Chen,2005

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of the microstructure, distribution of the intermetallic compounds, and mechanical behavior of SC07 solders with In, Ni, and TiO2 NPs minor additions;Journal of Materials Science: Materials in Electronics;2024-05

2. Effect of Ag nanoparticles on microstructure evolution, hardness, and bismuth segregation of SnBi/Cu joint;Journal of Materials Science: Materials in Electronics;2023-10

3. Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding;Journal of Welding and Joining;2023-08-31

4. Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties;Materials & Design;2022-03

5. Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems;Journal of Materials Science: Materials in Electronics;2021-11-05

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