Influence of nitrogen microwave radicals on sequential plasma activated bonding
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference14 articles.
1. Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics
2. Wafer Scale Packaging of MEMS by Using Plasma-Activated Wafer Bonding
3. Chemical Free Room Temperature Wafer To Wafer Direct Bonding
4. Proc 54th Electron Compon Technol conf;Suga,2004
5. Room temperature wafer level glass/glass bonding
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