Wafer Scale Packaging of MEMS by Using Plasma-Activated Wafer Bonding-Reference-Cited by-同舟云学术

Wafer Scale Packaging of MEMS by Using Plasma-Activated Wafer Bonding

Published:2006 Issue:1 Volume:153 Page:G78
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Suni T.,Henttinen K.,Lipsanen A.,Dekker J.,Luoto H.,Kulawski M.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO[sub 2]

2. Q.-Y. Tong and U. Gösele ,Semiconductor Wafer Bonding, p. 25, John Wiley & Sons, New York (1999).

3. D. C. Hermes, T. Heuser, E. J. van der Wouden, J. G. E. Gardeniers, and A. van den Berg ,Workshop on Wafer Bonding for MEMS Technologies, Book of Abstracts, pp. 37-38, Halle, Germany (2004).

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