A review: wafer bonding of Si-based semiconductors-Reference-Cited by-同舟云学术

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A review: wafer bonding of Si-based semiconductors

Published:2020-06-09 Issue:32 Volume:53 Page:323001
ISSN:0022-3727
Container-title:Journal of Physics D: Applied Physics
language:
Short-container-title:J. Phys. D: Appl. Phys.

Author:

Ke Shaoying^ORCID,Li Dongke^ORCID,Chen Songyan^ORCID

Funder

Presidential Research Fund of Minnan Normal University

Natural Science Research Project of Huaian, Jiangsu Shuangchuang program for Doctor

General Armaments Department of China

National Natural Science Foundation of China

National Key Research and Development Program of China

Publisher

IOP Publishing

Subject

Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1088/1361-6463/ab8769/pdf

Reference156 articles.

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2. Biomimetic Microelectronics for Regenerative Neuronal Cuff Implants

3. Photonic Crystal Microcavities in a Microelectronics 45-nm SOI CMOS Technology

4. Digitally Printed Dewetting Patterns for Self-Organized Microelectronics

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