Outgassing and Leak Rates of Bonding Technologies for Quantum Systems
Author:
Affiliation:
1. Institute of Quantum Technologies, German Aerospace Center,Ulm,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10649892/10652259/10652366.pdf?arnumber=10652366
Reference5 articles.
1. Quantum sensors will start a revolution — if we deploy them right
2. A review: wafer bonding of Si-based semiconductors
3. Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics
4. Contributed Review: The feasibility of a fully miniaturized magneto-optical trap for portable ultracold quantum technology
5. Vapor pressure of rubidium between 250 and 298 K determined by combined fluorescence and absorption measurements
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