Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu– x Zn microbumps and Zn-doped solder joints
Author:
Funder
MOST
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference11 articles.
1. Enhancement of the impact toughness in Sn–Ag–Cu/Cu solder joints via modifying the microstructure of solder alloy
2. Critical Concerns in Soldering Reactions Arising from Space Confinement in 3-D IC Packages
3. EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing
4. Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process
5. Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging
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4. Microstructure characterization of (Sn1−Zn )57(In0.78Bi0.22)43 low melting point lead-free solder materials;Transactions of Nonferrous Metals Society of China;2023-01
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