Enhancement of the impact toughness in Sn–Ag–Cu/Cu solder joints via modifying the microstructure of solder alloy
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference8 articles.
1. Shock impact reliability characterization of a handheld product in accelerated tests and use environment
2. Impact crack propagation through the dual-phased (Cu,Ni)6Sn5 layer in Sn–Ag–Cu/Ni solder joints
3. Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
4. Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions
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1. Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature;Soldering & Surface Mount Technology;2019-09-02
2. Non-Eutectic Low Melting Temperature Alloys for Standard c-Si Interconnection;SSRN Electronic Journal;2018
3. Low-Temperature and Low-Pressure Cu-Cu Bonding by Pure Cu Nanosolder Paste for Wafer-Level Packaging;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05
4. High impact reliability and high temperature performance of Fe and Bi added Sn-1Ag-0.5Cu solder alloys;Journal of Materials Science: Materials in Electronics;2017-02-04
5. Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders;Microelectronics Reliability;2016-08
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