Enhancing mechanical strength of full intermetallic microbump via grain refinement by Zn in thermocompression bonding-Reference-Cited by-同舟云学术

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Enhancing mechanical strength of full intermetallic microbump via grain refinement by Zn in thermocompression bonding

Published:2022-11 Issue: Volume:291 Page:126781
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Song Rui-Wen,Chen Wei-Yu,Wang Yu-Ching,Wu Zih-You,Tsai Su-Yueh,Duh Jenq-Gong^ORCID

Funder

National Tsing Hua University

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference40 articles.

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2. Recent advances and trends in advanced packaging;Lau;IEEE Trans. Compon. Packag. Manuf. Technol.,2022

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4. 3D Integration and the Use of Face-To-Face Chip Stacking for Logic Devices,2019

5. Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-On-Logic Die Stacking,2020

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1. Microstructure modification and mechanical reinforcement in sub-10 μm scale Cu/Sn–Ag/Cu microbump joints via Co-addition of Zn and Ni in Cu substrates;Materials Chemistry and Physics;2024-11

2. Impact of Hydrogen Voiding in Chip-to-Chip Electroless All-Copper Interconnections;Micromachines;2024-04-30

3. Alteration of Cu3Sn growth and retention of multi-orientation Cu6Sn5 during thermal aging in Cu-xNi-yZn/Sn3.5Ag/Cu transient liquid-phase bonding;Materials Characterization;2024-01

4. Low temperature bonding of Cu/Sn58Bi/Cu with 5μm microbump for high temperature applications;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

5. Eliminating Preferred Orientation and Refining Grain Size with Ni Doping in Cu/Sn-3.0Ag-0.5Cu/Cu TLP Bonding under Isothermal Aging Treatment;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

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