Effect of magnetic field on microstructure and property of Ag-Sn solder alloys-Reference-Cited by-同舟云学术

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Effect of magnetic field on microstructure and property of Ag-Sn solder alloys

Published:2021-11 Issue: Volume:303 Page:130515
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Wu Yu-qin,Tian Ze-an,Liu Fang,Yuan Zi-Hou,Chen Wei,Zhang Chi,Li Cheng-xin

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference19 articles.

1. Improvement of wettability and tensile property in Sn–Ag–RE lead-free solder alloy

2. Role of cerium in microstructure and corrosion properties of Sn-1.0Ag solder alloys

3. Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology

4. V. L. Niranjani, B. S. S. Chandra Rao, Rajdeep Sarkar, S. V. Kamat,J.AlloysCompd., 542 (2012) 136–141.

5. Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigating the influence of rotating magnetic field (RMF) on intermetallic compound crystallization, thermal and mechanical properties in lead-free Sn-Ag-Cu solder alloys during solidification;Materials Today Communications;2024-06

2. Optimization of creep and thermal features of the Sn-Ag-Cu-Zn alloy by the magnetic field;Microelectronics Reliability;2023-04

3. Effect of Supergravity Field on the Microstructure and Mechanical Properties of Highly Conductive Cu Alloys;Materials;2023-03-21

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