Improvement of wettability and tensile property in Sn–Ag–RE lead-free solder alloy
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference14 articles.
1. Issues in the replacement of lead-bearing solders
2. Metallurgy of low temperature Pb-free solders for electronic assembly
3. Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder
4. Fatigue crack growth behavior in 63Sn-37Pb and 95Pb-5Sn solder materials
5. Fatigue crack growth behavior of 96.5Sn–3.5Ag lead-free solder
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