Effect of surface roughness on void formation and intermetallic growth in electrodeposited Cu-Sn stacks
Author:
Funder
Industrial Research and Consultancy Centre
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference10 articles.
1. P. Ramm, A. Lu, James Jian-qiang, M.M.V. Taklo, Handbook of Wafer Bonding, 2012.
2. Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints
3. On the root cause of Kirkendall voiding in Cu3Sn
4. Interfacial reactions between lead-free solders and common base materials
5. The fast formation of Cu-Sn intermetallic compound in Cu/Sn/Cu system by induction heating process
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Finite Element Simulation Study of the Effects of Kirkendall Voids in IMC Layer on Interfacial Crack and Reliability of Cu–Sn Solder Joint;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Phase field study on the effect of roughness on interfacial intermetallic compounds of micro-solder joints under multifield coupling;Microelectronics Reliability;2022-10
3. Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging;Materials and Manufacturing Processes;2022-07-28
4. Effect of substrate surface roughness on interfacial reaction at Sn-3.0Ag/(001)Cu interface;Vacuum;2022-03
5. Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology;Electronic Materials Letters;2021-06-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3